- Silvia Abrahão, U. Politécnica de Valencia, Spain
- Maria C. Annosi, Ericsson, Italy
- Brian Berenbach, Siemens, USA
- Dan Berry, U. Waterloo, Canada
- Juan P. Carvallo, U. del Azuay, Ecuador
- Reidar Conradi, NTNU, Norway
- Oliver Creighton, Siemens, Germany
- Daniela Damian, U. Victoria, Canada
- Joerg Doerr, Fraunhofer, Germany
- Deepak Dunghana, Siemens, Austria
- Christof Ebert, Vector, Germany
- Remo Ferrari, Siemens, USA
- Steven Fraser, Cisco Research, USA
- Marcela Genero, U. Castilla - La Mancha, Spain
- Paul Gruenbacher, Johannes Kepler U., Austria
- Frank Houdek, Daimler A.G., Germany
- James Hulgan, Seilevel, USA
- Ross Jeffery, U. of New South Wales, Australia
- Natalia Juristo, U. Politécnica de Madrid, Spain
- Zude Li, Central South U., China
- Robyn Lutz, Iowa State U., USA
- Tomi Männistö, Aalto U., Finland
- Alistair Mavin, Rolls Royce, UK
- Andriy Miranskyy, IBM, Canada
- Parastoo Mohagheghi, NAV & NTNU, Norway
- Shariyar Murtaza, Corcordia U. & Defence, Canada
- Adam Porter, U. Maryland, USA
- Dewayne Perry, U. Texas, USA
- Bjorn Regnell, Lund U., Sweden
- Carolyn Seaman, UMBC, USA
- Robert Schwanke, Siemens, USA
- Tetsuo Tamai, Hosei U., Japan
- John Terzakis, Intel, USA
- Marco Torchiano, Politecnico Torino, Italy
- Salvador Trujillo, Ikerlan, Spain
- Roel Wieringa, U. Twente, The Netherlands
- Jon Whittle, Lancaster U., UK
|